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CUSTOMER PRODUCT PORTFOLIO

合作伙伴 · 客户产品矩阵

STC 服务的全球客户与产品矩阵，覆盖工业传感、智能家居、机器人、消费电子等领域，以全流程制造能力赢得长期信赖。

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已上传合作伙伴资料

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Sensata Technologies

USA Industrial Sensors

为 AZL 工业传感器控制模块提供从 PCBA 到 Boxbuild 的端到端制造，包括三防漆涂覆与气密性测试。

Eight Sleep

USA Smart Home

为 Pod 智能温控床系列（POD5 & POD6）生产控制板 PCBA，POP 封装叠层与波峰焊工艺。

Sunny Automotive

China Intelligent Machine

为 HDB-001 泳池清洁机器人与 MR-001 智能割草机器人主板 PCBA 制造，选择性波峰焊与三防漆工艺。

Hualai Technologies

China WIZE CAM

为 PAN V3 智能摄像头提供从 PCBA 到整机组装到零售包装的全流程制造，覆盖 4 阶段测试。

DELL

USA Consumer Electronics / IT

为 NFC 天线板（FPC）提供 PCBA 制造，含底部填充（Underfill）胶水强化工艺。

客户总览表 · Customer Summary Table

Item	Sensata	Eight Sleep	Sunny Auto	Hualai	DELL
Country	USA	USA	China	China	USA
Sector	Industrial Sensors	Smart Home	Intelligent Machine	WIZE CAM	Consumer Electronics / IT
Mfg. Classification	PCBA + Boxbuild	PCBA Level	PCBA Level	PCBA + Boxbuild + Final Package	PCBA Level
In-Running Model	AZL	POD5 & POD6	HDB-001 / MR-001	PAN V3	NFC Antenna Board
Process Requirement	SMT + Conformal Coating + Boxbuild	SMT + Wave Soldering	SMT + Selective Wave + Conformal Coating + Wave Solder + Aging	SMT + FCT + Boxbuild + BT + Package	SMT + Underfill + FCT
PCB Type	FR-4	FR-4	FR-4 (OSP) / FR-4 6-Layer (Au ENIG)	FR-4	FPC
Test Requirement	ICT & FCT & Air Leak Test	FCT	Firmware & FCT + Programming & Aging & FCT	Firmware & FCT & BT + Air Leak Test	FCT
Special Requirements	IPX6	NA	IPX8 Aging Test	IPX6	Underfill
PCBA Parts Spec	Chip: 0201	Chip: 0201 / QFN 0.4mm pitch / POP	0201 / QFN 0.4mm + CPU + Network Port	Chip: 0201 / QFN 0.4mm pitch / CMOS	Chip: 0201 / Fine-pitch NFC IC

Sensata Technologies

USA Industrial Sensors PCBA + Boxbuild In-Running Model: AZL

FULL NAME

Sensata Technologies

COUNTRY

USA

SECTOR

Industrial Sensors

MFG. CLASSIFICATION

PCBA + Boxbuild

IN-RUNNING MODEL

AZL

SPECIAL REQUIREMENT

IPX6 Waterproof

Sensata Technologies 是工业传感器和电气保护解决方案领域的全球领导者，专业提供压力、温度、速度和电流传感器，服务工业自动化、汽车和航空航天领域。STC 为其制造 AZL 传感器控制模块，提供从 PCBA 组装到完整 Boxbuild 集成的端到端服务。

1. Product (Series) Name + Model

Item	Details
Product Series	Industrial Sensor Control Module — PCBA + Boxbuild
In-Running Model	AZL
Product Positioning	Industrial-grade sensor signal processing and control module
Mfg. Classification	PCBA + Boxbuild (PCBA assembly + full system integration)
Product Form	PCBA board + full boxbuild assembly (housing, wiring harness, connectors)

2. Production Process

Manufacturing Scope: PCBA + Boxbuild (PCBA assembly + full system integration)

PCBA Assembly Process

Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Pre-AOI Inspection→ Reflow Soldering→ AOI Inspection→ X-Ray Inspection→ Conformal Coating→ FCT

Boxbuild Assembly Process

PCBA Functional Test→ Housing Assembly→ Wiring Harness Connection→ System Integration→ System-Level Test→ Air Leak Test→ Final QC→ Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201	Minimum component size 0201 (0.6mm x 0.3mm)
Pre-AOI Inspection	100% coverage	Pre-reflow optical inspection to verify component placement before soldering
Reflow Soldering	Lead-free process	RoHS / REACH compliant
Conformal Coating	Acrylic / Silicone	Moisture, salt spray, and fungus protection
AOI Inspection	100% coverage	Automated optical inspection of all solder joints
Boxbuild	Housing + Harness + PCBA	Complete system-level integration
Air Leak Test	IPX6 standard	Verifies enclosure sealing performance

3. Test Process

Test Requirements: ICT & FCT & Air Leak Test (Triple-Stage Testing)

Test Type	Test Content	Standard	Accept Criteria
ICT (In-Circuit Test)	Resistance / capacitance / diode / transistor online testing	IPC-9252	100% pass
FCT (Functional Test)	Sensor signal acquisition, processing, and output verification	Customer spec	All functions pass
Air Leak Test	System-level IPX6 waterproof integrity test	IPX6 standard	No leakage detected

4. Technical Difficulty & Competitive Advantages

IPX6Special Requirement IPX6: Withstands powerful water jets from any direction, suitable for harsh industrial environments.
02010201 Micro-Component Placement: Precision placement of 0201-size components demands exceptional equipment accuracy and process control.
CoatingConformal Coating Precision: Coating thickness and coverage carefully controlled to avoid connector surfaces and thermal areas.
SealingAir-Tightness Assurance: Assembled unit must pass Air Leak Test, requiring precise enclosure design and assembly tolerances.
ScopeFull PCBA + Boxbuild Scope: One-stop manufacturing from PCBA to system integration ensures product consistency and quality traceability.

Comparison	Product	Industry Standard
Waterproof Rating	IPX6 (Powerful Water Jets)	IPX4 (Splash Proof)
Test Coverage	ICT + FCT + Air Leak (Triple)	FCT Only
Manufacturing Scope	PCBA + Boxbuild (Full Scope)	PCBA Only
Environmental Protection	Conformal Coating + IPX6 (Dual)	Single Protection

5. PCBA Specifications & Features

Specification	Details
Substrate Material	FR-4 (Tg ≥ 150°C)
Surface Finish	Au (ENIG) — Excellent surface flatness, superior oxidation resistance, low contact resistance
Components	Chip parts: 0201 package; IC: QFN / SOP packages
Connectors	Industrial-grade connectors with waterproof rating

Product Images & Applications

Sensata AZL Sensor Control Module PCBA — Fig 1: Sensata AZL Sensor Control Module — PCBA Assembly

Sensata AZL Industrial Sensor Finished Product — Fig 2: Sensata AZL Industrial Sensor — Finished Product with Wiring Harness

Applications: Industrial automation sensors, factory environmental monitoring, industrial equipment condition monitoring. IPX6 waterproofing + conformal coating for harsh industrial environments.

Eight Sleep

USA Smart Home PCBA Level In-Running Model: POD5 & POD6

FULL NAME

Eight Sleep

COUNTRY

USA

SECTOR

Smart Home

MFG. CLASSIFICATION

PCBA Level

IN-RUNNING MODEL

POD5 & POD6 (Two Generations)

SPECIAL REQUIREMENT

NA (None)

Eight Sleep 是领先的智能家居 / 睡眠科技公司。旗舰 Pod 系列具备智能温控床垫与睡眠追踪功能。STC 制造 POD5 和 POD6 两个世代的控制板 PCBA。

1. Product (Series) Name + Model

Item	Details
Product Series	Smart Home Pod Temperature Control Board — PCBA
In-Running Model	POD5 & POD6 (Two Generations)
Mfg. Classification	PCBA Level (PCBA assembly and soldering only)
Product Positioning	Temperature regulation core control board for smart mattress system
Product Form	Single PCBA board (control board only, no housing assembly)

2. Production Process

Manufacturing Scope: PCBA Level (PCBA assembly + wave soldering + test)

PCBA Assembly Process

Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Pre-AOI Inspection→ Reflow Soldering→ AOI Inspection→ Wave Soldering (POP)→ FCT→ Final QC→ Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201 / QFN 0.4mm pitch	Minimum component size 0201 + fine-pitch QFN POP package
Reflow Soldering	Lead-free process	RoHS / REACH compliant
Wave Soldering	POP package-on-package	Secondary soldering for stacked package structure
AOI Inspection	100% coverage	Automated optical inspection of all solder joints

3. Test Process

Test Requirements: FCT (Functional Test)

Test Type	Test Content	Standard	Accept Criteria
FCT (Functional Test)	Temperature control loop, sensor I/O, WiFi/BT module verification	Customer spec	All functions pass

4. Technical Difficulty & Competitive Advantages

POPPOP Package-on-Package: Stacked package structure requires precise wave soldering without disturbing upper layer.
QFN0.4mm Fine-Pitch QFN: Tight pad pitch demands exceptional stencil printing and reflow profile control.
Dual GenDual-Generation Compatibility: Single line supports both POD5 and POD6 production, reducing changeover time.

Comparison	Product	Industry Standard
Package Structure	POP (Stacked)	Single-layer SMT
QFN Pitch	0.4mm	0.5mm
Process	SMT + Wave Soldering	Reflow only

5. PCBA Specifications & Features

Specification	Details
Substrate Material	FR-4
Surface Finish	Au (ENIG)
Components	Chip: 0201, QFN 0.4mm pitch, POP stack, WiFi/BT module
Special Process	POP Package-on-Package secondary wave soldering

Product Images & Applications

Eight Sleep POD5 & POD6 PCBA — Fig 3: Eight Sleep POD5 & POD6 Temperature Control Board PCBA

Eight Sleep POD5 & POD6 Finished Product — Fig 4: Eight Sleep POD5 & POD6 — Assembled Finished Product

Applications: Smart home / smart bedroom, used with the Eight Sleep Pod series smart temperature-controlled mattress. Features include intelligent temperature regulation, sleep tracking, and app-based remote control via WiFi.

Sunny Automotive

China Intelligent Machine PCBA Level HDB-001 Pool Cleaner · MR-001 Lawn Mower

FULL NAME

Sunny Automotive

COUNTRY

China

SECTOR

Intelligent Machine

MFG. CLASSIFICATION

PCBA Level (Two Projects)

IN-RUNNING MODELS

HDB-001 Pool Cleaner / MR-001 Lawn Mower

SPECIAL REQUIREMENTS

IPX8 (HDB-001) / Aging Test (MR-001)

Sunny Automotive 专注于智能机器设备。STC 制造 HDB-001 泳池清洁机器人和 MR-001 智能割草机器人的主板 PCBA，前者具备自主导航与智能路径规划能力，后者支持 GPS RTK 导航与 AI 避障。

Project 1: Robotic Pool Cleaner — HDB-001

1. Product (Series) Name + Model

Item	Details
Product Series	Robotic Pool Cleaner Mainboard — PCBA
In-Running Model	HDB-001 Robotic Pool Cleaner
Mfg. Classification	PCBA Level (PCBA assembly and soldering only)
Product Positioning	Core control module for autonomous underwater cleaning robot

2. Production Process

Manufacturing Scope: PCBA Level (PCBA assembly + conformal coating + test)

PCBA Assembly Process

Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Pre-AOI Inspection→ Reflow Soldering→ AOI Inspection→ X-Ray Inspection→ Selective Wave Soldering→ Conformal Coating→ Firmware Programming→ FCT→ Final QC→ Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201 / QFN 0.4mm	High-density placement with fine-pitch QFN
Selective Wave Soldering	Selective aperture	For through-hole connectors and power components
Conformal Coating	Acrylic	IPX8 waterproof protection for underwater operation
Firmware Programming	Customer spec	In-system programming of MCU firmware

3. Test Process

Test Requirements: Firmware & FCT

Test Type	Test Content	Standard	Accept Criteria
Firmware Programming	MCU firmware flash + verification	Customer spec	100% pass
FCT (Functional Test)	Motor control, sensor I/O, WiFi/BT module verification	Customer spec	All functions pass

Product Images & Applications

Sunny HDB-001 Robotic Pool Cleaner PCBA — Fig 5: Sunny HDB-001 Robotic Pool Cleaner Mainboard PCBA

Sunny HDB-001 Robotic Pool Cleaner Finished Product — Fig 6: Sunny HDB-001 Robotic Pool Cleaner — Finished Product

Applications: Residential and commercial pool automated cleaning. Autonomous navigation, intelligent cleaning, IPX8 underwater operation, WiFi/Bluetooth wireless control.

Project 2: Intelligent Lawn Mower — MR-001

1. Product (Series) Name + Model

Item	Details
Product Series	Intelligent Lawn Mower Mainboard — PCBA
In-Running Model	MR-001 Intelligent Lawn Mower
Mfg. Classification	PCBA Level (PCBA assembly and soldering only)
Product Positioning	Core control module for intelligent autonomous lawn mowing robot

2. Production Process

Manufacturing Scope: PCBA Level (PCBA assembly + programming + aging + test)

PCBA Assembly Process

Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Pre-AOI Inspection→ Reflow Soldering→ AOI Inspection→ X-Ray Inspection→ Wave Soldering→ Firmware Programming→ Aging Test→ FCT→ Final QC→ Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201	Minimum component size 0201
Pre-AOI Inspection	100% coverage	Pre-reflow optical inspection to verify component placement before soldering
Reflow Soldering	Lead-free process	RoHS / REACH compliant
Wave Soldering	THD through-hole components	Batch soldering for CPU socket and network port connectors
Aging Test	Continuous burn-in	Multi-hour functional burn-in for reliability validation

3. Test Process

Test Requirements: Programming & Aging & FCT

Test Type	Test Content	Standard	Accept Criteria
Programming	MCU firmware flash + verification	Customer spec	100% pass
Aging Test	Multi-hour burn-in under power	Customer spec	No early-life failure
FCT (Functional Test)	Motor control, RTK GPS, sensor I/O, WiFi/BT module verification	Customer spec	All functions pass

4. PCBA Specifications & Features

Specification	Details
Substrate Material	FR-4 6-Layer (Au ENIG)
Components	0201 / QFN 0.4mm / CPU / Network Port
Special Process	THD wave soldering for CPU socket + Network port (RJ45 / Ethernet connector)

Product Images & Applications

Fig 7: Sunny MR-001 Intelligent Lawn Mower Mainboard PCBA (6-Layer + ENIG)

Sunny MR-001 Intelligent Lawn Mower Finished Product — Fig 8: Sunny MR-001 Intelligent Lawn Mower — Finished Product

Applications: Intelligent autonomous lawn mowing for residential and commercial lawns. Features include GPS RTK navigation, AI obstacle avoidance, adaptive cutting height, boundary wire / virtual mapping, rain detection, and anti-theft alarm. 6-layer rigid board with CPU and network port enables complex real-time control and cloud connectivity.

Hualai Technologies

China WIZE CAM PCBA + Boxbuild + Final Package In-Running Model: PAN V3

FULL NAME

Hualai Technologies

COUNTRY

China

SECTOR

WIZE CAM (Smart Camera)

MFG. CLASSIFICATION

PCBA + Boxbuild + Final Package

IN-RUNNING MODEL

PAN V3

SPECIAL REQUIREMENT

IPX6 Waterproof

Hualai Technologies 生产 WIZE CAM 系列智能摄像头。STC 为 PAN V3 型号提供端到端制造服务 — 从 PCBA 组装到整机组装，再到零售包装。

1. Product (Series) Name + Model

Item	Details
Product Series	WIZE CAM Smart Camera — PCBA + Boxbuild + Final Package
In-Running Model	PAN V3
Mfg. Classification	PCBA + Boxbuild + Final Package (Full Manufacturing Scope)
Product Positioning	Smart home monitoring camera with HD video + AI detection
Product Form	Fully assembled finished product, retail-ready packaged

2. Production Process

Manufacturing Scope: PCBA + Boxbuild + Final Package (4-Stage Test Regime)

PCBA Assembly Process

Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Pre-AOI Inspection→ Reflow Soldering→ AOI Inspection→ X-Ray Inspection→ Manual Soldering→ ICT→ Firmware Programming→ FCT

Boxbuild Assembly Process

Lens & Sensor Mounting→ Housing Assembly→ BT Pairing Test→ System-Level Test→ Air Leak Test→ Final QC→ Retail Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201 / QFN 0.4mm pitch / CMOS	High-density placement for compact camera mainboard
Manual Soldering	Selective hand-solder	For components requiring manual attachment
Lens Assembly	Optical alignment	Precision lens & image sensor mounting
Air Leak Test	IPX6 standard	Verifies enclosure waterproof sealing

3. Test Process

Test Requirements: Firmware & FCT & BT + Air Leak Test (4-Stage Test Regime)

Test Type	Test Content	Standard	Accept Criteria
ICT (In-Circuit Test)	Resistance / capacitance / diode / transistor online testing	IPC-9252	100% pass
FCT (Functional Test)	Sensor signal, WiFi/BT module, image capture verification	Customer spec	All functions pass
BT Pairing Test	Bluetooth pairing + communication	Customer spec	Successful pairing
Air Leak Test	System-level IPX6 waterproof integrity	IPX6 standard	No leakage detected

4. Technical Difficulty & Competitive Advantages

ScopeFull-Scope Manufacturing: End-to-end from PCBA to retail packaging, single-vendor accountability.
IPX6IPX6 Waterproof: Comprehensive enclosure sealing ensures outdoor and bathroom environment use.
OpticalOptical Assembly Precision: Lens & sensor mounting alignment critical for image quality.
4-Stage4-Stage Test Regime: ICT + FCT + BT Pairing + Air Leak provides full coverage before retail ship-out.

5. PCBA Specifications & Features

Specification	Details
Substrate Material	FR-4
Surface Finish	Au (ENIG)
Components	0201 / QFN 0.4mm pitch / CMOS image sensor / WiFi+BT dual-mode module
Special Process	IPX6 waterproof enclosure + optical lens assembly

Product Images & Applications

Fig 9: Hualai WIZE CAM PAN V3 Mainboard PCBA

Hualai WIZE CAM PAN V3 Smart Camera Finished Product — Fig 10: Hualai WIZE CAM PAN V3 Smart Camera — Finished Product

Applications: Home security monitoring, remote caretaking, smart home integration. HD video, AI detection, two-way audio, WiFi + BT dual-mode, IPX6 waterproofing. Full manufacturing chain from board to retail-ready packaging.

DELL

USA Consumer Electronics / IT PCBA Level In-Running Model: NFC Antenna Board

FULL NAME

DELL

COUNTRY

USA

SECTOR

Consumer Electronics / IT

MFG. CLASSIFICATION

PCBA Level

IN-RUNNING MODEL

NFC Antenna Board

SPECIAL REQUIREMENT

Underfill (Epoxy Adhesive)

STC 为 DELL 消费电子与 IT 设备提供 NFC（近场通信）天线模块的 PCBA 制造。FPC 柔性基板允许集成到紧凑、超薄设备中。底部填充胶水确保在反复弯折与操作应力下的长期机械可靠性。

1. Product (Series) Name + Model

Item	Details
Product Series	NFC Antenna Module — FPC PCBA Assembly
In-Running Model	NFC Antenna Board
Mfg. Classification	PCBA Level (PCBA assembly and soldering only)
Product Positioning	NFC antenna module for DELL consumer electronics and IT devices
Product Form	FPC (Flexible Printed Circuit) with mounted NFC IC and passive components

2. Production Process

Manufacturing Scope: PCBA Level (FPC SMT + Underfill adhesive dispensing + FCT)

FPC PCBA Assembly Process

FPC Incoming QC→ Solder Paste Printing→ SPI Inspection→ SMT Placement→ Reflow Soldering→ AOI Inspection→ Underfill Adhesive Dispensing→ Underfill Curing→ FCT→ Final QC→ Packaging

Process Step	Technical Parameter	Description
SMT Placement	Chip parts: 0201, Fine-pitch NFC IC	High-precision placement on flexible substrate
Reflow Soldering	Low-temperature profile	FPC-compatible profile to prevent substrate warping
Underfill Dispensing	Epoxy adhesive	Under-key-component reinforcement for mechanical strength
Underfill Curing	Thermal cure	Controlled temperature ramp for proper adhesive crosslinking

3. Test Process

Test Requirements: FCT (Functional Test)

Test Type	Test Content	Standard	Accept Criteria
FCT (Functional Test)	NFC communication range + data transfer verification	Customer spec	All functions pass

4. Technical Difficulty & Competitive Advantages

FPCFPC Flexible Substrate: Polyimide-based flexible substrate requires low-temperature reflow profile and precision handling.
UnderfillUnderfill Adhesive: Epoxy adhesive dispensed under key components provides mechanical reinforcement against repeated bending.
NFC ICFine-Pitch NFC IC: Tight-pitch placement demands exceptional stencil printing and reflow control.

Comparison	Product	Industry Standard
Substrate	FPC (Flexible)	Rigid FR-4
Reinforcement	Underfill (Epoxy)	No reinforcement
Form Factor	Ultra-thin / Bendable	Rigid board

5. PCBA Specifications & Features

Specification	Details
Substrate Material	FPC (Flexible Printed Circuit) — Polyimide-based flexible substrate
Surface Finish	ENIG or OSP (depending on design requirements)
Components	1. Chip parts: 0201 package 2. Fine-pitch NFC IC 3. Passive antenna components
Special Process	Underfill — Epoxy adhesive dispensed under key components for mechanical reinforcement

Product Images & Applications

DELL NFC Antenna Board FPC PCBA — Fig 11: DELL NFC Antenna Board — FPC PCBA Assembly (SMT + Underfill)

DELL NFC Antenna Board Finished Product — Fig 12: DELL NFC Antenna Board — Finished Product with Label and Connector

Applications: NFC (Near Field Communication) antenna module for DELL consumer electronics and IT devices. Enables contactless data transfer, mobile payment, and device pairing. FPC flexible substrate allows integration into compact, thin-profile devices. Underfill adhesive ensures long-term mechanical reliability under repeated bending and handling stress.

附录 · 客户能力对比表

Manufacturing Scope Comparison

Customer	SMT	Special Solder	Coating	Boxbuild	Final Pkg
Sensata	●	—	●	●	—
Eight Sleep	●	Wave	—	—	—
Sunny Auto	●	Selective Wave	●	—	—
Hualai	●	Manual	—	●	●
DELL	●	—	—	—	—

Test Requirements Comparison

Customer	ICT	FCT	Firmware	BT	Air Leak
Sensata	●	●	—	—	●
Eight Sleep	—	●	—	—	—
Sunny Auto	—	●	●	—	—
Hualai	—	●	●	●	●
DELL	—	●	—	—	—

PCB Surface Finish & Waterproof Rating

Customer	Surface Finish	IP Rating	Conformal Coating
Sensata	Au (ENIG)	IPX6	●
Eight Sleep	Au (ENIG)	NA	—
Sunny Auto	OSP	IPX8	●
Hualai	Au (ENIG)	IPX6	—
DELL	ENIG / OSP	NA	—

PCBA Component Specifications

Customer	Chip Parts	QFN Pitch	POP	CMOS
Sensata	0201	—	—	—
Eight Sleep	0201	0.4mm	●	—
Sunny Auto	0201	0.4mm	—	—
Hualai	0201	0.4mm	—	●
DELL	0201	—	—	—

业务概览

PCBA SMT 制造

整机组装

OEM / ODM 服务

供应链管理

工程能力

SMT 贴片产线实拍

工厂实景

资质认证

智慧管理平台

工厂智能体

品质智能体

交付智能体

成本智能体

AI 智能体搭建 CCD 视觉检测系统

AI 视觉 SOP 工序实时监控系统

复用现有硬件

写代码代替买方案

检测准确率 99.2%

持续自学习

合作伙伴 · 客户产品矩阵

已上传合作伙伴资料

Sensata Technologies

Eight Sleep

Sunny Automotive

Hualai Technologies

DELL

客户总览表 · Customer Summary Table

Sensata Technologies

1. Product (Series) Name + Model

2. Production Process

3. Test Process

4. Technical Difficulty & Competitive Advantages

5. PCBA Specifications & Features

Product Images & Applications

Eight Sleep

1. Product (Series) Name + Model

2. Production Process

3. Test Process

4. Technical Difficulty & Competitive Advantages

5. PCBA Specifications & Features

Product Images & Applications

Sunny Automotive

Project 1: Robotic Pool Cleaner — HDB-001

1. Product (Series) Name + Model

2. Production Process

3. Test Process

Product Images & Applications

Project 2: Intelligent Lawn Mower — MR-001

1. Product (Series) Name + Model

2. Production Process

3. Test Process

4. PCBA Specifications & Features

Product Images & Applications

Hualai Technologies

1. Product (Series) Name + Model

2. Production Process

3. Test Process

4. Technical Difficulty & Competitive Advantages

5. PCBA Specifications & Features

Product Images & Applications

DELL

1. Product (Series) Name + Model

2. Production Process

3. Test Process

4. Technical Difficulty & Competitive Advantages

5. PCBA Specifications & Features

Product Images & Applications

附录 · 客户能力对比表

Manufacturing Scope Comparison

Test Requirements Comparison

PCB Surface Finish & Waterproof Rating

PCBA Component Specifications

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